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861400081YO2LF

861400081YO2LF

861400081YO2LF

Amphenol ICC (FCI)

BERGSTIK® Series 1-Row Header, Breakaway Solder Copper Alloy Bulk Through Hole Gold or Gold, GXT™ Thermoplastic 8-Position Board to Board 0.102 2.60mm Height

SOT-23

861400081YO2LF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Contact MaterialCopper Alloy
Contact PlatingGXT, Gold
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Thermoplastic
Housing Material Thermoplastic
PackagingBulk
Series BERGSTIK®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Breakaway
Number of Positions 8
Max Operating Temperature125°C
Min Operating Temperature -55°C
Number of Rows 1
Voltage - Rated 1000V
Fastening TypePush-Pull
Contact Finish - Mating Gold or Gold, GXT™
Contact Type Male Pin
Current Rating (Amps) 3A
Pitch 2.54mm
Orientation Straight
Depth 2.54mm
Insulation Height 0.102 2.60mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Contact Length - Post 0.118 3.00mm
Shrouding Unshrouded
Number of Contacts 8
Contact Length - Mating 0.276 7.00mm
Overall Contact Length 0.496 12.60mm
Contact Resistance 20mOhm
Max Voltage Rating (AC) 1kV
Length 20.32mm
Contact Finish Thickness - Mating 8.00μin 0.203μm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:47403 items

Pricing & Ordering

QuantityUnit PriceExt. Price

861400081YO2LF Product Details

861400081YO2LF Overview


Packaging is Header, Breakaway.Through Hole is the mounting type.Packaging for the product is carried out via a Bulk case.As a product of the BERGSTIK® Series, it can be found in this category.Temperatures below 125°C are best for using it.There's a minimum temperature of -55°C for this device.In this case, Through Hole mounts the part.

861400081YO2LF Features


BERGSTIK® series


861400081YO2LF Applications


There are a lot of Amphenol ICC (FCI)
861400081YO2LF Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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