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8609428E113765000E1

8609428E113765000E1

8609428E113765000E1

Amphenol ICC (FCI)

8609428E113765000E1 datasheet pdf and Backplane Connectors - DIN 41612 product details from Amphenol ICC (FCI) stock available on our website

SOT-23

8609428E113765000E1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole, Right Angle
Material - Insulation Polyester Thermoplastic
Operating Temperature-55°C~125°C
PackagingTray
Series 8609
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Male Pins
Number of Positions 48 (42 + 6 Power)
Max Operating Temperature125°C
Min Operating Temperature -55°C
Number of Rows 3
Current Rating (Amps) 1.5A
Pitch 0.100 2.54mm
Style M
Number of Positions Loaded 42
Current Rating1.5A
Contact Finish Gold
Level, Class 1
Material Flammability Rating UL94 V-0
RoHS StatusNon-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
In-Stock:2221 items

About 8609428E113765000E1

The 8609428E113765000E1 from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features 8609428E113765000E1 datasheet pdf and Backplane Connectors - DIN 41612 product details from Amphenol ICC (FCI) stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8609428E113765000E1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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