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76230-501LF

76230-501LF

76230-501LF

Amphenol ICC (FCI)

Contact PIN Press Fit ST Thru-Hole Reel

SOT-23

76230-501LF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialPhosphor Bronze
Contact PlatingGXT, Gold, Tin
Mount Through Hole
Mounting Type Through Hole
Body Material Bronze
Mounting Hole Diameter 0.040 (1.02mm)
PackagingReel
Published 2007
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Max Operating Temperature125°C
Min Operating Temperature -40°C
Voltage - Rated 1kV
HTS Code8536.90.40.00
Pitch 2.54mm
Depth 1.22mm
Current Rating5A
Contact Finish Gold, GXT™
Contact Gender Male
Body Plating Gold
Terminal and Terminal Block Type PCB TERMINAL
Insulation Non-Insulated
Terminal TypeSingle Post
Hole Diameter 1.016 mm
Terminal Style Pin Retention
Pin Size - Above Flange 0.025 0.64mm Square
Pin Size - Below Flange 0.025 0.64mm Square
Length 9.525mm
Contact Finish Thickness 30.0μin 0.76μm
Length - Overall 0.375 9.53mm
Board Thickness 0.093 ~ 0.125 2.36mm ~ 3.18mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:4592 items

About 76230-501LF

The 76230-501LF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features Contact PIN Press Fit ST Thru-Hole Reel.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 76230-501LF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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