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76209-005

76209-005

76209-005

Amphenol ICC (FCI)

Contact PIN Solder ST Thru-Hole Loose

SOT-23

76209-005 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Contact MaterialPhosphor Bronze
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole
Mounting Hole Diameter 0.034 ~ 0.036 (0.86mm ~ 0.91mm)
PackagingBulk
Published 2008
Series Bergpin®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Connector, PCB, Signal
Contact Finish Gold
Insulation Non-Insulated
Terminal TypeSingle Post
Hole Diameter 914.4 μm
Terminal Style Pin Retention
Pin Size - Above Flange 0.025 0.64mm Square
Pin Size - Below Flange 0.025 0.64mm Square
Length 11.684mm
Contact Finish Thickness 15.0μin 0.38μm
Length - Overall 0.460 11.68mm
Board Thickness 0.062 ~ 0.125 1.57mm ~ 3.18mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:3752 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 76209-005

The 76209-005 from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features Contact PIN Solder ST Thru-Hole Loose.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 76209-005, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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