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7434L0423F01LF

7434L0423F01LF

7434L0423F01LF

Amphenol ICC (FCI)

Conn Smart Card M 8 POS 2.54mm Solder RA Thru-Hole Tray 1A/Contact

SOT-23

7434L0423F01LF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Through Hole
Mounting Type Through Hole, Right Angle
Mounting FeatureNormal, Standard - Top
Housing Material Thermoplastic
PackagingTray
Published 2010
Series L04
JESD-609 Code e3
Feature Board Guide, Board Lock, Switch
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Through Hole
ECCN Code EAR99
Connector Type Connector
Number of Positions 10 (8 + 2)
Number of Rows 2
Voltage - Rated 1kV
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Pitch 2.54mm
Orientation Right Angle
Depth 40mm
Current Rating1A
Contact Finish Gold
Number of Contacts 8
Card Type Smart Card
Insulation Resistance1GOhm
Insertion, Removal Method Push In, Pull Out
Height 9mm
Length 62mm
Height Above Board 0.354 9.00mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:4828 items

About 7434L0423F01LF

The 7434L0423F01LF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Smart Card M 8 POS 2.54mm Solder RA Thru-Hole Tray 1A/Contact.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 7434L0423F01LF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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