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55101-T1104LF

55101-T1104LF

55101-T1104LF

Amphenol ICC (FCI)

Conn Unshrouded Header HDR 4 POS 2.54mm Solder RA Thru-Hole Poly Bag

SOT-23

55101-T1104LF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact MaterialPhosphor Bronze
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
PackagingBulk
Series BERGSTIK®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 4
Color Black
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Tin
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.140 3.56mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Contact Length - Post 0.090 2.29mm
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
Contact Finish Thickness - Mating 100.0μin 2.54μm
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:24140 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 55101-T1104LF

The 55101-T1104LF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn Unshrouded Header HDR 4 POS 2.54mm Solder RA Thru-Hole Poly Bag.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 55101-T1104LF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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