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54201-S0810ALF

54201-S0810ALF

54201-S0810ALF

Amphenol ICC (FCI)

CONN HEADER SMD 10POS 2.54MM

SOT-23

54201-S0810ALF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact MaterialPhosphor Bronze
Contact PlatingGXT, Gold
Mount Surface Mount
Mounting Type Surface Mount
Contact Shape Square
PackagingTape & Reel (TR)
Published 2013
Series BERGSTIK®
Feature Pick and Place
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 10
Color Black
Number of Rows 1
Fastening TypePush-Pull
Contact Finish - Mating Gold or Gold, GXT™
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
Contact Finish Thickness - Mating 15.0μin 0.38μm
Contact Finish Thickness - Post 100.0μin 2.54μm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:6848 items

Pricing & Ordering

QuantityUnit PriceExt. Price
740$0.93161$689.3914

About 54201-S0810ALF

The 54201-S0810ALF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER SMD 10POS 2.54MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 54201-S0810ALF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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