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10005639-11008LF

10005639-11008LF

10005639-11008LF

Amphenol ICC (FCI)

Conn DDR2 DIMM Socket SKT 240 POS 2mm Solder ST Thru-Hole Tray

SOT-23

10005639-11008LF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Contact MaterialBronze
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole
Mounting FeatureNormal, Standard - Top
Insulation Material Resin
Housing Material Thermoplastic
PackagingTray
Feature Board Lock, Latches
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Through Hole
Number of Positions 240
Max Operating Temperature105°C
Min Operating Temperature -55°C
Number of Rows 2
Pitch 2mm
Orientation Straight
Depth 7.6mm
Current Rating500mA
Contact Finish Gold
Voltage - Rated AC 100V
Number of Contacts 240
Contact Resistance 30mOhm
Insulation Resistance1MOhm
Connector Style DIMM
Memory TypeDDR2 SDRAM
Standards MO-237
Height 25.6mm
Length 147.5mm
Contact Finish Thickness 30.0μin 0.76μm
Length - Tail 2.54mm
RoHS StatusRoHS Compliant
In-Stock:2996 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 10005639-11008LF

The 10005639-11008LF from Amphenol ICC (FCI) is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn DDR2 DIMM Socket SKT 240 POS 2mm Solder ST Thru-Hole Tray.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 10005639-11008LF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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