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ATS-55170R-C1-R0

ATS-55170R-C1-R0

ATS-55170R-C1-R0

Advanced Thermal Solutions Inc.

Heat Sink Passive BGA Cross-Cut Adhesive 11.3C/W Black Anodized

SOT-23

ATS-55170R-C1-R0 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Adhesive
Material Aluminum
Shape Square, Fins
Package Cooled BGA
Material Finish Black Anodized
Published 2008
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Depth 17mm
Attachment Method Thermal Tape, Adhesive (Included)
Height Off Base (Height of Fin) 0.768 19.50mm
Thermal Resistance @ Forced Air Flow 11.30°C/W @ 200 LFM
Length 0.669 17.00mm
Width 0.669 17.00mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:899 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$6.153974$6.153974
10$5.805635$58.05635
100$5.477015$547.7015
500$5.166995$2583.4975
1000$4.874524$4874.524

About ATS-55170R-C1-R0

The ATS-55170R-C1-R0 from Advanced Thermal Solutions Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features Heat Sink Passive BGA Cross-Cut Adhesive 11.3C/W Black Anodized.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ATS-55170R-C1-R0, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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