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ASPI-1367-R10M-T

ASPI-1367-R10M-T

ASPI-1367-R10M-T

Abracon LLC

FIXED IND 100NH 60A 0.5 MOHM SMD

SOT-23

ASPI-1367-R10M-T Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case Nonstandard
Terminal Shape WRAPAROUND
Material - Core Ferrite
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature-40°C~125°C
PackagingTape & Reel (TR)
Published 2009
Series ASPI-1367
Size / Dimension 0.551Lx0.508W 14.00mmx12.90mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination SMD/SMT
ECCN Code EAR99
Type Wirewound
HTS Code8504.50.80.00
Packing Method TR
Shielding YES
Number of Functions 1
Depth 12.9mm
Current Rating60A
Inductance 100nH
Test Frequency200kHz
DC Resistance (DCR) 0.5mOhm Max
Max DC Current 75A
Inductor Application HIGH CURRENT INDUCTOR
Terminal Placement DUAL ENDED
Current - Saturation 80A
Case/Size Code 5451
Height 6.7mm
Height Seated (Max) 0.264 6.70mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:4178 items

About ASPI-1367-R10M-T

The ASPI-1367-R10M-T from Abracon LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features FIXED IND 100NH 60A 0.5 MOHM SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the ASPI-1367-R10M-T, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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