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593002B00000G

593002B00000G

593002B00000G

Aavid, Thermal Division of Boyd Corporation

593002B00000G datasheet pdf and Thermal - Heat Sinks product details from Aavid, Thermal Division of Boyd Corporation stock available on our website

SOT-23

593002B00000G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Bolt
Package / Case TO-220
Material Aluminum
Shape Rectangular, Fins
Package Cooled TO-220
Material Finish Black Anodized
Published 2007
Series Channel 5900
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level, Vertical
Color Black
Depth 12.7mm
Attachment Method Bolt On
Height Off Base (Height of Fin) 0.500 12.70mm
Thermal Resistance @ Forced Air Flow 4.00°C/W @ 600 LFM
Thermal Resistance @ Natural 13.40°C/W
Power Dissipation @ Temperature Rise 1.0W @ 20°C
Height 29.98mm
Length 1.180 29.97mm
Width 1.000 25.40mm
RoHS StatusRoHS Compliant
In-Stock:18866 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 593002B00000G

The 593002B00000G from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features 593002B00000G datasheet pdf and Thermal - Heat Sinks product details from Aavid, Thermal Division of Boyd Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 593002B00000G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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