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592502B00000G

592502B00000G

592502B00000G

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK

SOT-23

592502B00000G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Bolt
Package / Case TO-220
Material Aluminum
Shape Rectangular, Fins
Package Cooled TO-220
Material Finish Black Anodized
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level
Attachment Method Bolt On
Height Off Base (Height of Fin) 0.250 6.35mm
Thermal Resistance @ Forced Air Flow 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural 22.00°C/W
Power Dissipation @ Temperature Rise 1.5W @ 40°C
Length 1.250 31.75mm
Width 0.875 22.22mm
RoHS StatusRoHS Compliant
In-Stock:1618 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 592502B00000G

The 592502B00000G from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features BOARD LEVEL HEAT SINK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 592502B00000G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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