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577202B04000G

577202B04000G

577202B04000G

Aavid, Thermal Division of Boyd Corporation

HEATSINK TO-220 .500" COMPACT

SOT-23

577202B04000G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Bolt, PC Pin, Solder
Package / Case TO-220
Material Aluminum
Weight 113.398093g
Shape Rectangular, Fins
Package Cooled TO-220
Material Finish Black Anodized
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level, Vertical
Color Black
Depth 12.7mm
Attachment Method Bolt On and PC Pin
Height Off Base (Height of Fin) 0.500 12.70mm
Thermal Resistance @ Forced Air Flow 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural 24.40°C/W
Power Dissipation @ Temperature Rise 1.5W @ 40°C
Height 19.05mm
Length 0.750 19.05mm
Width 0.520 13.21mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:2985 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.969946$2.969946
10$2.801835$28.01835
100$2.643241$264.3241
500$2.493624$1246.812
1000$2.352475$2352.475

About 577202B04000G

The 577202B04000G from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEATSINK TO-220 .500" COMPACT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 577202B04000G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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