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573300D00010G

573300D00010G

573300D00010G

Aavid, Thermal Division of Boyd Corporation

HEATSINK D2PAK .4" HIGH SMD

SOT-23

573300D00010G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount PCB, Surface Mount
Package / Case TO-263
Material Aluminum
Shape Rectangular, Fins
Package Cooled TO-263 (D2Pak)
Material Finish Tin
PackagingTape & Reel (TR)
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Top Mount
Depth 12.7mm
Attachment Method SMD Pad
Height Off Base (Height of Fin) 0.400 10.16mm
Thermal Resistance @ Forced Air Flow 10.00°C/W @ 200 LFM
Thermal Resistance @ Natural 18.00°C/W
Power Dissipation @ Temperature Rise 1.3W @ 30°C
Height 10.16mm
Length 0.500 12.70mm
Width 1.030 26.16mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:7232 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.173378$1.173378
10$1.106960$11.0696
100$1.044302$104.4302
500$0.985190$492.595
1000$0.929425$929.425

About 573300D00010G

The 573300D00010G from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features HEATSINK D2PAK .4" HIGH SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 573300D00010G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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