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530001B00000

530001B00000

530001B00000

Aavid, Thermal Division of Boyd Corporation

BOARD LEVEL HEAT SINK

SOT-23

530001B00000 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Bolt
Material Aluminum
Shape Rectangular, Fins
Package Cooled TO-218
Material Finish Black Anodized
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Board Level
Attachment Method Bolt On
Height Off Base (Height of Fin) 1.000 25.40mm
Thermal Resistance @ Forced Air Flow 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural 3.80°C/W
Power Dissipation @ Temperature Rise 16.0W @ 50°C
Length 2.500 63.50mm
Width 1.650 41.91mm
RoHS StatusNon-RoHS Compliant
In-Stock:3242 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 530001B00000

The 530001B00000 from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features BOARD LEVEL HEAT SINK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 530001B00000, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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