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159900F00000G

159900F00000G

159900F00000G

Aavid, Thermal Division of Boyd Corporation

Adhesive,1 quart,2 part (resin + hardener)

SOT-23

159900F00000G Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mount Adhesive
Package / Case Epoxy
Published 2009
Series Ther-O-Bond 1500
Size / Dimension 1 qt Bottle
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Resin and Hardener
Color Black
Shelf Life 18 Months
Shelf Life Start Date of Manufacture
Usable Temperature Range -76°F~311°F -60°C~155°C
RoHS StatusRoHS Compliant
In-Stock:63 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$453.83000$453.83
500$449.2917$224645.85
1000$444.7534$444753.4
1500$440.2151$660322.65
2000$435.6768$871353.6
2500$431.1385$1077846.25

About 159900F00000G

The 159900F00000G from Aavid, Thermal Division of Boyd Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features Adhesive,1 quart,2 part (resin + hardener).

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 159900F00000G, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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