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BSV10Q

BSV10Q

BSV10Q

3M

Conn.;Crimp Term.;Splice;Butt;12-10AWG;Vinyl Insul.;Butted;Highland

SOT-23

BSV10Q Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact MaterialCopper
Contact PlatingTin
Insulation Material Vinyl
Weight 703.068173g
PackagingBulk
Published 2013
Series Highland™
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Color Yellow
Orientation Straight
Approval Agency CSA, UL
Wire Gauge10-12 AWG
Wire Gauge (Max) 12 AWG
Wire Gauge (Min) 10 AWG
Wire/Cable Gauge 10 AWG
Insulation Fully Insulated
Terminal TypeButt Splice, Inline, Individual Openings
Number of Wire Entries 2
Height 114.3mm
Length 25.91mm
Width 139.7mm
Thickness 1.016mm
RoHS StatusRoHS Compliant
In-Stock:1392 items

About BSV10Q

The BSV10Q from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn.;Crimp Term.;Splice;Butt;12-10AWG;Vinyl Insul.;Butted;Highland.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BSV10Q, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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