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BB4X24-8882/HIGHGEL

BB4X24-8882/HIGHGEL

BB4X24-8882/HIGHGEL

3M

BB4X24-8882/HIGHGEL datasheet pdf and Splice Enclosures, Protection product details from 3M stock available on our website

SOT-23

BB4X24-8882/HIGHGEL Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Series Better Buried
Published 2010
Feature High Gel
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) Not Applicable
Type Buried Closure Splice Kit, Re-Enterable
Number of Cable Pairs 200 Pairs @ 22 AWG, 400 Pairs @ 24 AWG
Sheath Opening 17.00 (431.8mm)
Length - Overall 30.00 762.0mm
Diameter - Inside 4.000 (101.60mm)
RoHS StatusRoHS Compliant
In-Stock:4305 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$311.22000$311.22
10$300.85000$3008.5
25$280.10200$7002.55

About BB4X24-8882/HIGHGEL

The BB4X24-8882/HIGHGEL from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features BB4X24-8882/HIGHGEL datasheet pdf and Splice Enclosures, Protection product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BB4X24-8882/HIGHGEL, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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