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BB3X24-8882/HIGHGEL

BB3X24-8882/HIGHGEL

BB3X24-8882/HIGHGEL

3M

BB3X24-8882/HIGHGEL datasheet pdf and Splice Enclosures, Protection product details from 3M stock available on our website

SOT-23

BB3X24-8882/HIGHGEL Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Series Better Buried
Published 2010
Feature High Gel
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) Not Applicable
Type Buried Closure Splice Kit, Re-Enterable
Number of Cable Pairs 100 Pairs @ 22 AWG, 200 Pairs @ 24 AWG
Sheath Opening 17.00 (431.8mm)
Length 609.6mm
Length - Overall 28.00 711.2mm
Diameter - Inside 3.000 (76.20mm)
RoHS StatusRoHS Compliant
In-Stock:1599 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$224.08000$224.08
10$216.60800$2166.08
25$201.66960$5041.74
50$198.68200$9934.1

About BB3X24-8882/HIGHGEL

The BB3X24-8882/HIGHGEL from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features BB3X24-8882/HIGHGEL datasheet pdf and Splice Enclosures, Protection product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the BB3X24-8882/HIGHGEL, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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