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94744

94744

94744

3M

94744 datasheet pdf and Terminals - Ring Connectors product details from 3M stock available on our website

SOT-23

94744 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialCopper, ETP
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Weight 1.406136kg
Material - Insulation Polyamide (PA), Nylon
PackagingBulk
Series Highland™
Published 2002
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Color Yellow
Orientation Straight
Contact Finish Tin
Wire Gauge10-12 AWG
Wire Gauge (Max) 12 AWG
Wire Gauge (Min) 10 AWG
Wire/Cable Gauge 10 AWG
Insulation Diameter 0.250 (6.35mm)
Insulation Insulated
Terminal TypeCircular
Stud/Tab Size 3/8 Stud
Length 32.766mm
Width 15mm
Thickness 0.040 1.02mm
Length - Overall 1.290 32.77mm
Width - Outer Edges 0.590 14.99mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:13210 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.700000$0.7
10$0.660377$6.60377
100$0.622998$62.2998
500$0.587733$293.8665
1000$0.554466$554.466

About 94744

The 94744 from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features 94744 datasheet pdf and Terminals - Ring Connectors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 94744, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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