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94740

94740

94740

3M

94740 datasheet pdf and Terminals - Ring Connectors product details from 3M stock available on our website

SOT-23

94740 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialCopper, ETP
Contact PlatingTin
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Weight 1.133981kg
Material - Insulation Polyamide (PA), Nylon
PackagingBulk
Series Highland™
Published 2002
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Color Yellow
Orientation Straight
Contact Finish Tin
Wire Gauge10-12 AWG
Wire Gauge (Max) 12 AWG
Wire Gauge (Min) 10 AWG
Wire/Cable Gauge 10 AWG
Insulation Diameter 0.250 (6.35mm)
Insulation Insulated
Terminal TypeCircular
Stud/Tab Size 10 Stud
Length 26.162mm
Width 9.65mm
Thickness 0.040 1.02mm
Length - Overall 1.030 26.16mm
Width - Outer Edges 0.380 9.65mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:13374 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.545000$0.545
10$0.514151$5.14151
100$0.485048$48.5048
500$0.457593$228.7965
1000$0.431691$431.691

About 94740

The 94740 from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features 94740 datasheet pdf and Terminals - Ring Connectors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 94740, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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