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83P-55-P-A

83P-55-P-A

83P-55-P-A

3M

83P-55-P-A datasheet pdf and Terminals - Wire Pin Connectors product details from 3M stock available on our website

SOT-23

83P-55-P-A Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Contact MaterialCopper, ETP
Number of Pins 110
Weight 2.131884g
Material - Insulation Vinyl
PackagingBulk
Series Scotchlok™
Published 2015
Feature Butted Seam
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Crimp
Color Yellow
Gender Male
Contact Finish Tin
Lead Length 13.97mm
Wire Gauge10-12 AWG
Wire Gauge (Max) 10 AWG
Wire Gauge (Min) 12 AWG
Insulation Diameter 0.250 (6.35mm)
Insulation Insulated
Pin Diameter Circular - 0.110 (2.79mm) Dia
Length 28.067mm
Length - Termination 0.250 6.35mm
Length - Overall 1.105 28.07mm
Diameter - Barrel ID 0.135 (3.43mm)
Length - Pin 0.550 13.97mm
RoHS StatusRoHS Compliant
In-Stock:27027 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.320000$0.32
10$0.301887$3.01887
100$0.284799$28.4799
500$0.268678$134.339
1000$0.253470$253.47

About 83P-55-P-A

The 83P-55-P-A from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features 83P-55-P-A datasheet pdf and Terminals - Wire Pin Connectors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 83P-55-P-A, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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