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3M869XW LPSA DISC 1.865X.102"

3M869XW LPSA DISC 1.865X.102"

3M869XW LPSA DISC 1.865X.102"

3M

LAPPING FILM SIL DIOXIDE 1.87"

SOT-23

3M869XW LPSA DISC 1.865X.102" Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 3 Weeks
Abrasive Material Silicon Dioxide
Series 869XW
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Type Lapping Film
Applications Fiber Optic Connector Polishing
Diameter 1.87 47.49mm
RoHS StatusRoHS Compliant
In-Stock:7654 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 3M869XW LPSA DISC 1.865X.102"

The 3M869XW LPSA DISC 1.865X.102" from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features LAPPING FILM SIL DIOXIDE 1.87".

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3M869XW LPSA DISC 1.865X.102", including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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