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100-024-051

100-024-051

100-024-051

3M

100-024-051 datasheet pdf and Sockets for ICs, Transistors product details from 3M stock available on our website

SOT-23

100-024-051 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole
Number of Pins 24
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 24 (2 x 12)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature-65°C~125°C
PackagingBulk
Series 100
Published 2008
Feature Closed Frame, Seal Tape
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.6 (15.24mm) Row Spacing
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Gold
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 8.00μin 0.203μm
Contact Finish Thickness - Post Flash
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:1003 items

About 100-024-051

The 100-024-051 from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features 100-024-051 datasheet pdf and Sockets for ICs, Transistors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 100-024-051, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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