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100-008-051

100-008-051

100-008-051

3M

100-008-051 datasheet pdf and Sockets for ICs, Transistors product details from 3M stock available on our website

SOT-23

100-008-051 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole
Number of Pins 8
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Contact Material - Post Brass
Operating Temperature-65°C~125°C
PackagingBulk
Series 100
Published 2008
Feature Closed Frame, Seal Tape
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type DIP, 0.3 (7.62mm) Row Spacing
Contact Finish - Mating Gold
Current Rating (Amps) 1A
Pitch 2.54mm
Pitch - Mating 0.100 2.54mm
Contact Finish - Post Gold
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 8.00μin 0.203μm
Contact Finish Thickness - Post Flash
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:4147 items

About 100-008-051

The 100-008-051 from 3M is a high-performance microcontroller designed for a wide range of embedded applications. This component features 100-008-051 datasheet pdf and Sockets for ICs, Transistors product details from 3M stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 100-008-051, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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