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EPF8820ARC208-2

EPF8820ARC208-2

EPF8820ARC208-2

Intel

FPGAs FLEX 8000 Series 208-BFQFP Exposed Pad

SOT-23

EPF8820ARC208-2 Datasheet

non-compliant

In-Stock: 2565 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 208-BFQFP Exposed Pad
Supplier Device Package 208-RQFP (28x28)
Operating Temperature 0°C~70°C TA
Packaging Tray
Series FLEX 8000
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.75V~5.25V
Base Part Number EPF8820
Number of I/O 152
Number of Logic Elements/Cells 672
Number of Gates 8000
Number of LABs/CLBs 84
EPF8820ARC208-2 Product Details

EPF8820ARC208-2 Overview


There is a 208-BFQFP Exposed Pad package that includes this component. Having 152 I/Os makes data transfers more coherent. A fundamental building block consists of 672 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. There is a 4.75V~5.25V-volt supply voltage required for the device to operate. FPGAs belonging to the FLEX 8000 series are a type of FPGA that belong to the FLEX 8000 series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~70°C TA when operating the machine. There is an FPGA model contained in Tray in order to conserve space. Its base part number EPF8820 can be used to find parts that are related to it. 84 LABs and CLBs are built into this FPGA. 8000 gates make up the basic block of its construction. There is a device package provided by 208-RQFP (28x28), which is the supplier.

EPF8820ARC208-2 Features


152 I/Os

EPF8820ARC208-2 Applications


There are a lot of Intel EPF8820ARC208-2 FPGAs applications.

  • Wired Communications
  • Medical imaging
  • Medical Applications
  • Scientific Instruments
  • Data center hardware accelerators
  • Filtering and communication encoding
  • Wireless Communications
  • Distributed Monetary Systems
  • Industrial,Medical and Scientific Instruments
  • Electronic Warfare

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