In the package 304-BFQFP, this product is provided. A total of 208 I/Os allow data to be transferred in a more coherent manner. To form a fundamental building block, there are 1296 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 4.75V~5.25V battery. This is a type of FPGA that is part of the FLEX 8000 series of FPGAs. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~70°C TA at all times. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. For related parts, use its base part number EPF81500. Fpga electronics contains 162 LABs/CLBs in an array. A basic building block for this type of building block consists of 16000 gates. There is a device package provided by 304-RQFP (40x40), which is the supplier.
EPF81500ARC304-3 Features
208 I/Os
EPF81500ARC304-3 Applications
There are a lot of Intel EPF81500ARC304-3 FPGAs applications.