EPF81500ARC304-2 Overview

A 304-BFQFP package is provided with this component. 208 I/Os are available for transferring data more efficiently. A fundamental building block is made up of 1296 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 4.75V~5.25V. FPGAs belonging to the FLEX 8000 series are a type of FPGA that belong to the FLEX 8000 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~70°C TA when the device is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. For related parts, use its base part number EPF81500. An array of 162 LABs/CLBs is built into the FPGA. The basic building block of this system consists of 16000 gates. There is a device package provided by 304-RQFP (40x40), which is the supplier.

EPF81500ARC304-2 Features

208 I/Os

EPF81500ARC304-2 Applications

There are a lot of Intel EPF81500ARC304-2 FPGAs applications.

• Military Temperature
• Data center search engines
• Automotive Applications
• Artificial intelligence (AI)
• DO-254
• ASIC prototyping
• Secure Communication
• Device controllers
• Electronic Warfare
• Security systems