EPF6010AFC100-3 Overview

As part of the 100-LBGA package, it is included. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 71 I/Os are available for transferring data more efficiently. Logic elements/cells form the fundamental building block of a computer. Power is provided by a 3.3V-volt supply. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 3V~3.6V and uses a battery to supply power. The FLEX 6000 Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at 0°C~85°C TJ when operating. In order to save space, this FPGA model has been contained in Tray. 100 terminations are present in total. A total of 88 LABs/CLBs are included in this FPGA. Fpga semiconductor is made up of 10000 gates as fpga semiconductors basic building block. Usually, fpga semiconductor uses a 133MHz crystal. In its architecture, there are 880 CLB modules.

EPF6010AFC100-3 Features

71 I/Os

EPF6010AFC100-3 Applications

There are a lot of Intel EPF6010AFC100-3 FPGAs applications.

• Filtering and communication encoding
• Data center hardware accelerators
• Artificial intelligence (AI)
• Development Boards and Shields for Microcontrollers
• Embedded Vision
• ASIC prototyping
• Solar Energy
• Bioinformatics
• Medical ultrasounds
• Medical Electronics