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EP4SGX110HF35I3G

EP4SGX110HF35I3G

EP4SGX110HF35I3G

Intel

FPGAs Stratix? IV GX Series 1152-BBGA, FCBGA

SOT-23

EP4SGX110HF35I3G Datasheet

non-compliant

In-Stock: 3113 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Stratix® IV GX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.87V~0.93V
Number of I/O 488
Number of Logic Elements/Cells 105600
Total RAM Bits 9793536
Number of LABs/CLBs 4224
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
EP4SGX110HF35I3G Product Details

EP4SGX110HF35I3G Overview


Fpga chips is supplied in the 1152-BBGA, FCBGA package. Fpga chips is programmed wFpga chipsh 488 I/Os for transferring data in a more coherent manner. The basic building blocks of logic contain 105600 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. In order for it to operate, the supply voltage must be 0.87V~0.93V . There are many types of FPGAs in the Stratix? IV GX series, this is one of them. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device is equipped with 9793536 RAM bits in terms of its RAM si9793536e. A total of 4224 LABs/CLBs are included in this FPGA.

EP4SGX110HF35I3G Features


488 I/Os
Up to 9793536 RAM bits

EP4SGX110HF35I3G Applications


There are a lot of Intel EP4SGX110HF35I3G FPGAs applications.

  • Enterprise networking
  • Image processing
  • Military DSP
  • Voice recognition
  • Industrial IoT
  • Military Temperature
  • ASIC prototyping
  • Secure Communication
  • Software-defined radios
  • Artificial intelligence (AI)

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