EP4CGX15BN11I7N Overview

There are two packages that contain fpga chips: 148-WFQFN Dual Rows, Exposed Pad package and X package. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block contains 14400 logic elements or cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.16V~1.24V. The FPGA belongs to the Cyclone? IV GX series of FPGAs, and it is one type of FPGA. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. There is an FPGA model contained in Tray in order to conserve space. Fpga electronics is worth mentioning that this device provides 552960 bfpga electronics s of RAM. EP4CGX15 is the base part number that can be used to identify related parts. 900 LABs and CLBs are built into this FPGA. This device package is supplied by 148-QFN (11x11).

EP4CGX15BN11I7N Features

72 I/Os
Up to 552960 RAM bits

EP4CGX15BN11I7N Applications

There are a lot of Intel EP4CGX15BN11I7N FPGAs applications.

• Consumer Electronics
• Image processing
• Device controllers
• Security systems
• Military Temperature
• Industrial,Medical and Scientific Instruments
• DO-254
• Integrating multiple SPLDs
• Aircraft navigation
• Bioinformatics