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EP4CE6F17C7N

EP4CE6F17C7N

EP4CE6F17C7N

Intel

FPGAs Cyclone® IV E Series 256-LBGA

SOT-23

EP4CE6F17C7N Datasheet

non-compliant

In-Stock: 2346 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 256-LBGA
Supplier Device Package 256-FBGA (17x17)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone® IV E
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.15V~1.25V
Base Part Number EP4CE6
Number of I/O 179
Number of Logic Elements/Cells 6272
Total RAM Bits 276480
Number of LABs/CLBs 392
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $18.67000 $18.67
EP4CE6F17C7N Product Details

EP4CE6F17C7N Overview


In the 256-LBGA package, you will find fpga chips. The device has 179 I/O ports for more coherent data transfer. To form a fundamental building block, there are 6272 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.15V~1.25V-volt supply voltage required for the device to operate. The Cyclone® IV E Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 276480 bFpga chipss. You can find related parts by using the part number EP4CE6, which is its base part number. A total of 392 LABs/CLBs are included in this FPGA. Its supplier package is called 256-FBGA (17x17).

EP4CE6F17C7N Features


179 I/Os
Up to 276480 RAM bits


EP4CE6F17C7N Applications


There are a lot of Intel
EP4CE6F17C7N FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense

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