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EP3SL50F780C4G

EP3SL50F780C4G

EP3SL50F780C4G

Intel

FPGAs Stratix? III L Series 780-BBGA

SOT-23

EP3SL50F780C4G Datasheet

non-compliant

In-Stock: 1805 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 780-BBGA
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Stratix® III L
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 0.86V~1.15V
Number of I/O 488
Number of Logic Elements/Cells 47500
Total RAM Bits 2184192
Number of LABs/CLBs 1900
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
36 $555.50167 $19998.06012
EP3SL50F780C4G Product Details

EP3SL50F780C4G Overview


Fpga chips is supplied in the 780-BBGA package. This device features 488 I/Os in order to transfer data in a more efficient manner. Logic elements/cells form the fundamental building block of a computer. Surface Mount-connectors can be used to attach this FPGA module to the development board. The supply voltage of the device is 0.86V~1.15V , at which it runs. The FPGA belongs to the Stratix? III L series of FPGAs, and it is one type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 2184192 bFpga chipss. This FPGA is built as an array of 1900 LABs/CLBs.

EP3SL50F780C4G Features


488 I/Os
Up to 2184192 RAM bits

EP3SL50F780C4G Applications


There are a lot of Intel EP3SL50F780C4G FPGAs applications.

  • Ecosystem
  • Medical Electronics
  • Distributed Monetary Systems
  • Automation
  • Telecommunication
  • Radar and Sensors
  • Filtering and communication encoding
  • Automotive Applications
  • Electronic Warfare
  • Defense Applications

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