EP3SL200H780C3N Overview

This package is included in the 780-BBGA, FCBGA package and is available for purchase. This device features 488 I/Os in order to transfer data in a more efficient manner. A fundamental building block consists of 200000 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. A supply voltage of 0.86V~1.15V is needed in order for fpga chips to operate. The Stratix? III L Series is one of the types of FPGAs that belong to this type. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 10901504 RAM bits in terms of its RAM si10901504e. Related parts can be found by using its base part number EP3SL200. A total of 8000 LABs/CLBs make up this FPGA array. Its supplier package is called 780-HBGA (33x33).

EP3SL200H780C3N Features

488 I/Os
Up to 10901504 RAM bits

EP3SL200H780C3N Applications

There are a lot of Intel EP3SL200H780C3N FPGAs applications.

• Wireless Communications
• Broadcast
• Automotive
• Electronic Warfare
• Distributed Monetary Systems
• Bioinformatics
• Industrial Ethernet
• Medical imaging
• Industrial IoT
• ASIC prototyping