EP3SE50F484C3G Overview

In the 484-BBGA, FCBGA package, you will find fpga chips. This device features 296 I/Os in order to transfer data in a more efficient manner. A fundamental building block contains 47500 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 0.86V~1.15V battery. The Stratix? III E series FPGA is a type of FPGA that belongs to the Stratix? III E family of FPGAs. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. Fpga electronics is worth mentioning that this device provides 5760000 bfpga electronics s of RAM. The FPGA consists of 1900 LABs/CLBs. The device package supplied by 484-FBGA (23x23) is one of its suppliers.

EP3SE50F484C3G Features

296 I/Os
Up to 5760000 RAM bits

EP3SE50F484C3G Applications

There are a lot of Intel EP3SE50F484C3G FPGAs applications.

• Wired Communications
• Device controllers
• Data Center
• Video & Image Processing
• Audio
• Industrial IoT
• Aircraft navigation
• Telecommunication
• Wireless Communications
• DO-254