2.6mm mm FPGAs Cyclone? III Series 484-BGA 1mm mm 484
SOT-23
EP3C55F484C8N Datasheet
non-compliant
In-Stock: 4249 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
8 Weeks
Mounting Type
Surface Mount
Package / Case
484-BGA
Surface Mount
YES
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Series
Cyclone® III
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
484
ECCN Code
3A991
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.15V~1.25V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.2V
Terminal Pitch
1mm
[email protected] Reflow Temperature-Max (s)
40
Base Part Number
EP3C55
JESD-30 Code
R-PBGA-B484
Number of Outputs
327
Qualification Status
Not Qualified
Number of I/O
327
Clock Frequency
472.5MHz
Number of Inputs
327
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
55856
Total RAM Bits
2396160
Number of LABs/CLBs
3491
Height Seated (Max)
2.6mm
Length
23mm
Width
23mm
RoHS Status
RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$176.87000
$176.87
EP3C55F484C8N Product Details
EP3C55F484C8N Description
EP3C55F484C8N FPGA developed by Intel is a member of Cyclone III device family featuring a unique combination of high functionality, low power and low cost. Power consumption can be achieved based on silicon optimizations and software features delivered by TSMC low-power (LP) process technology and Altera® power-aware design flow, making this device well suited for high-volume, low-power, and cost-sensitive applications.
EP3C55F484C8N Features
Low-power operation
Lowest power consumption
High memory-to-logic and multiplier-to-logic ratio
Hot-socketing operation support
EP3C55F484C8N Applications
High-volume, low-power, and cost-sensitive applications