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EP2AGZ350FF35I3

EP2AGZ350FF35I3

EP2AGZ350FF35I3

Intel

FPGAs Arria II GZ Series 1152-BBGA, FCBGA

SOT-23

EP2AGZ350FF35I3 Datasheet

non-compliant

In-Stock: 4843 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 1152-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Arria II GZ
JESD-609 Code e0
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish TIN LEAD
Voltage - Supply 0.87V~0.93V
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number EP2AGZ350
Number of I/O 554
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 348500
Total RAM Bits 21270528
Number of LABs/CLBs 13940
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1.741002 $1.741002
10 $1.642455 $16.42455
100 $1.549486 $154.9486
500 $1.461779 $730.8895
1000 $1.379037 $1379.037
EP2AGZ350FF35I3 Product Details

EP2AGZ350FF35I3 Overview


This package is included in the 1152-BBGA, FCBGA package and is available for purchase. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 554 I/Os for better data transfer. A fundamental building block is made up of 348500 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Powered by a 0.87V~0.93V supply voltage, fpga chips is able to operate at high speeds. It is a type of FPGA that belongs to the Arria II GZ series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. As a space-saving measure, this FPGA model is contained within Tray. This device is equipped with 21270528 RAM bits in terms of its RAM si21270528e. Its base part number EP2AGZ350 can be used to find related parts. An array of 13940 LABs/CLBs is built into the FPGA.

EP2AGZ350FF35I3 Features


554 I/Os
Up to 21270528 RAM bits

EP2AGZ350FF35I3 Applications


There are a lot of Intel EP2AGZ350FF35I3 FPGAs applications.

  • Broadcast
  • Radar and Sensors
  • Automotive
  • Embedded Vision
  • Military Temperature
  • Wireless Communications
  • Distributed Monetary Systems
  • Automotive advanced driver assistance systems (ADAS)
  • Industrial IoT
  • Military DSP

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