EP2AGX260FF35I3NGA Overview

There are two packages that contain fpga chips: 1152-BBGA, FCBGA package and X package. 612 I/Os are available for transferring data more efficiently. A fundamental building block is made up of 244188 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. There is a 0.87V~0.93V-volt supply voltage required for the device to operate. An FPGA belonging to the Arria II GX series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 12038144 bFpga chipss. 10260 LABs and CLBs are built into this FPGA. 1152-FBGA (35x35) stands for its supplier device package.

EP2AGX260FF35I3NGA Features

612 I/Os
Up to 12038144 RAM bits

EP2AGX260FF35I3NGA Applications

There are a lot of Intel EP2AGX260FF35I3NGA FPGAs applications.

• Enterprise networking
• Integrating multiple SPLDs
• Device controllers
• Data Center
• Electronic Warfare
• Automotive Applications
• Military Temperature
• DO-254
• Automotive
• ADAS