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EP20K160EFC484-1XB

EP20K160EFC484-1XB

EP20K160EFC484-1XB

Intel

FPGAs APEX-20KE? Series 484-BBGA

SOT-23

EP20K160EFC484-1XB Datasheet

non-compliant

In-Stock: 4673 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 484-BBGA
Supplier Device Package 484-FBGA (23x23)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series APEX-20KE®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.71V~1.89V
Number of I/O 316
Number of Logic Elements/Cells 6400
Total RAM Bits 81920
Number of Gates 404000
Number of LABs/CLBs 640
EP20K160EFC484-1XB Product Details

EP20K160EFC484-1XB Overview


As part of the 484-BBGA package, it is included. There are 316 I/Os for better data transfer. There are 6400 logic elements/cells to form a fundamental building block. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 1.71V~1.89V-volt supply voltage required for the device to operate. As part of the APEX-20KE? series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Having a RAM bit size of 81920 means that this device will offer you a lot of memory. The FPGA is built as an array of 640 latches or CLBs. As a basic building block, fpga semiconductor consists of 404000 gates. There is a device package provided by 484-FBGA (23x23), which is the supplier.

EP20K160EFC484-1XB Features


316 I/Os
Up to 81920 RAM bits

EP20K160EFC484-1XB Applications


There are a lot of Intel EP20K160EFC484-1XB FPGAs applications.

  • Image processing
  • Voice recognition
  • Filtering and communication encoding
  • ASIC prototyping
  • Development Boards and Shields for Microcontrollers
  • Software-defined radios
  • Data Center
  • Industrial,Medical and Scientific Instruments
  • Automotive
  • Aerospace and Defense

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