EP20K100CF324C9 Overview

There are two packages that contain fpga chips: 324-BGA package and X package. Having 246 I/Os makes data transfers more coherent. A fundamental building block consists of 4160 logic elements/cells. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 2.375V~2.625V, this device operates with ease. It is a type of FPGA belonging to the APEX-20K? seies. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. This device has 53248 RAM bits, which is the number of RAM bits that this device offers. This FPGA is built as an array of 416 LABs/CLBs. Its basic building block contains 263000 gates. The device package supplied by 324-FBGA (19x19) is one of its suppliers.

EP20K100CF324C9 Features

246 I/Os
Up to 53248 RAM bits

EP20K100CF324C9 Applications

There are a lot of Intel EP20K100CF324C9 FPGAs applications.

• Defense Applications
• Video & Image Processing
• Enterprise networking
• Automotive Applications
• Server Applications
• Medical Applications
• DO-254
• Digital signal processing
• Military DSP
• Telecommunication