EP1K30FC256-3NAA Overview

There are two packages that contain fpga chips: 256-BBGA package and X package. There are 171 I/Os for better data transfer. To form a fundamental building block, there are 1728 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. Powered by a 2.375V~2.625V supply voltage, fpga chips is able to operate at high speeds. FPGAs belonging to the ACEX-1K? series are a type of FPGA that belong to the ACEX-1K? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~70°C TA when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. The RAM bits that are offered by this fpga chips are 24576. 216 LABs/CLBs are configured on this FPGA. The basic building block of this system consists of 119000 gates. The device package supplied by 256-FBGA (17x17) is one of its suppliers.

EP1K30FC256-3NAA Features

171 I/Os
Up to 24576 RAM bits

EP1K30FC256-3NAA Applications

There are a lot of Intel EP1K30FC256-3NAA FPGAs applications.

• Data center search engines
• Secure Communication
• Data center hardware accelerators
• Data Mining
• Industrial IoT
• Distributed Monetary Systems
• Industrial,Medical and Scientific Instruments
• Wired Communications
• Industrial Ethernet
• Medical Applications