EP1K100QC208-1GZ Overview

There are two packages that contain fpga chips: 208-BFQFP package and X package. Fpga chips is programmed wFpga chipsh 147 I/Os for transferring data in a more coherent manner. A fundamental building block contains 4992 logic elements or cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. This device is powered by a 2.375V~2.625V battery. There are many types of FPGAs in the ACEX-1K? series, this is one of them. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~70°C TA when the device is operating. As a space-saving measure, this FPGA model is contained within Tray. There are 49152 RAM bits that are available with this device. The FPGA consists of 624 LABs/CLBs. There are 257000 gates that make up its basic building block. There is a device package provided by 208-PQFP (28x28), which is the supplier.

EP1K100QC208-1GZ Features

147 I/Os
Up to 49152 RAM bits

EP1K100QC208-1GZ Applications

There are a lot of Intel EP1K100QC208-1GZ FPGAs applications.

• Audio
• Automotive advanced driver assistance systems (ADAS)
• Voice recognition
• Bioinformatics
• Military Temperature
• Data Center
• Telecommunication
• Data center hardware accelerators
• Medical Applications
• Server Applications