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EP1C4F400C8N

EP1C4F400C8N

EP1C4F400C8N

Intel

FPGAs Cyclone® Series 400-BGA

SOT-23

EP1C4F400C8N Datasheet

non-compliant

In-Stock: 3256 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 400-BGA
Supplier Device Package 400-FBGA (21x21)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Cyclone®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.425V~1.575V
Base Part Number EP1C4
Number of I/O 301
Number of Logic Elements/Cells 4000
Total RAM Bits 78336
Number of LABs/CLBs 400
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $46.420404 $46.420404
10 $43.792834 $437.92834
100 $41.313994 $4131.3994
500 $38.975466 $19487.733
1000 $36.769308 $36769.308
EP1C4F400C8N Product Details

EP1C4F400C8N Overview


A 400-BGA package contains it, and it is available for download. Its 301 I/Os help it transfer data more efficiently. A fundamental building block contains 4000 logic elements or cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the Cyclone® series are a type of FPGA that belong to the Cyclone® series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. Having a RAM bit size of 78336 means that this device will offer you a lot of memory. For related parts, use its base part number EP1C4. 400 LABs/CLBs are integrated into this FPGA. There is a device package provided by 400-FBGA (21x21), which is the supplier.

EP1C4F400C8N Features


301 I/Os
Up to 78336 RAM bits


EP1C4F400C8N Applications


There are a lot of Intel
EP1C4F400C8N FPGAs applications.


  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems

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