5SGSMD3H2F35C2N Overview

In the 1152-BBGA, FCBGA package, you will find fpga chips. A total of 432 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 236000 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. In order to operate it, it requires a voltage supply of 0.87V~0.93V . It is a type of FPGA that belongs to the Stratix? V GS series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 13312000 bFpga chipss. Its base part number 5SGSMD3 can be used to find related parts. A total of 89000 LABs/CLBs are included in this FPGA. It employs 1152-FBGA (35x35) as its supplier device package.

5SGSMD3H2F35C2N Features

432 I/Os
Up to 13312000 RAM bits

5SGSMD3H2F35C2N Applications

There are a lot of Intel 5SGSMD3H2F35C2N FPGAs applications.

• Random logic
• Solar Energy
• Aerospace and Defense
• Filtering and communication encoding
• Industrial,Medical and Scientific Instruments
• Medical ultrasounds
• Wired Communications
• Development Boards and Shields for Microcontrollers
• Medical imaging
• Data center hardware accelerators