1ST165EU3F50I3XG Overview

There are two packages that contain fpga chips: 2397-BBGA, FCBGA package and X package. 440 I/Os are available for transferring data more efficiently. There are 1650000 logic elements/cells to form a fundamental building block. Using a Surface Mount connector, you can mount this FPGA module on the development board. There is a 0.82V~0.88V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Stratix? 10 TX seies. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. Fpga electronics contains 206250 LABs/CLBs in an array.

1ST165EU3F50I3XG Features

440 I/Os

1ST165EU3F50I3XG Applications

There are a lot of Intel 1ST165EU3F50I3XG FPGAs applications.

• Automotive advanced driver assistance systems (ADAS)
• Cryptography
• Random logic
• Video & Image Processing
• Space Applications
• Device controllers
• Ecosystem
• Development Boards and Shields for Microcontrollers
• Digital signal processing
• Medical Applications