1SG250HH3F55I3VG Overview

In the 2912-BBGA, FCBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 1160 I/O ports for more coherent data transfer. In order to construct a fundamental building block, 2500000 logic elements/cells are required. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order to operate it, it requires a voltage supply of 0.77V~0.97V . As part of the Stratix? 10 GX series of FPGAs, it is a type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. The FPGA is built as an array of 312500 latches or CLBs.

1SG250HH3F55I3VG Features

1160 I/Os

1SG250HH3F55I3VG Applications

There are a lot of Intel 1SG250HH3F55I3VG FPGAs applications.

• Wired Communications
• Industrial IoT
• ASIC prototyping
• Integrating multiple SPLDs
• Computer hardware emulation
• Artificial intelligence (AI)
• Data Mining
• Medical imaging
• Electronic Warfare
• Image processing