1SG166HN3F43E2VG Overview

There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. The device has 688 I/O ports for more coherent data transfer. Logic blocks consist of 1660000 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. Powered by a 0.77V~0.97V supply voltage, fpga chips is able to operate at high speeds. This is a type of FPGA that is part of the Stratix? 10 GX series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. An array of 207500 LABs/CLBs is built into the FPGA.

1SG166HN3F43E2VG Features

688 I/Os

1SG166HN3F43E2VG Applications

There are a lot of Intel 1SG166HN3F43E2VG FPGAs applications.

• OpenCL
• Random logic
• Digital signal processing
• Defense Applications
• Medical Applications
• Data Center
• Wired Communications
• Wireless Communications
• Bioinformatics
• Data center search engines