1SG165HN3F43E2VG Overview

There are two packages that contain fpga chips: 1760-BBGA, FCBGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Having 688 I/Os makes data transfers more coherent. Logic elements/cells form the fundamental building block of a computer. The Surface Mount-slot connector on the FPGA module can be connected to the development board. With a supply voltage of 0.77V~0.97V, this device operates with ease. The FPGA belongs to the Stratix? 10 GX series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~100°C TJ while the machine is operating. An array of 206250 LABs/CLBs is built into the FPGA.

1SG165HN3F43E2VG Features

688 I/Os

1SG165HN3F43E2VG Applications

There are a lot of Intel 1SG165HN3F43E2VG FPGAs applications.

• ASIC prototyping
• Military Temperature
• Secure Communication
• Computer hardware emulation
• Embedded Vision
• Space Applications
• Data Center
• Integrating multiple SPLDs
• Aircraft navigation
• Data center hardware accelerators