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10M50DCF256I6G

10M50DCF256I6G

10M50DCF256I6G

Intel

FPGAs MAX? 10 Series 256-LBGA 256

SOT-23

10M50DCF256I6G Datasheet

non-compliant

In-Stock: 3055 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 256-LBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series MAX® 10
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish TIN SILVER COPPER
Voltage - Supply 1.15V~1.25V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B256
Number of I/O 178
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 50000
Total RAM Bits 1677312
Number of LABs/CLBs 3125
RoHS Status RoHS Compliant
10M50DCF256I6G Product Details

10M50DCF256I6G Overview


In the 256-LBGA package, you will find fpga chips. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. 178 I/Os are available for transferring data more efficiently. A fundamental building block contains 50000 logic elements or cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates at a voltage of 1.15V~1.25V and uses a battery to supply power. There are many types of FPGAs in the MAX? 10 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In order to save space, this FPGA model has been contained in Tray. In total, it has 256 terminations on each end. This device has 1677312 RAM bits, which is the number of RAM bits that this device offers. 3125 LABs and CLBs are built into this FPGA.

10M50DCF256I6G Features


178 I/Os
Up to 1677312 RAM bits

10M50DCF256I6G Applications


There are a lot of Intel 10M50DCF256I6G FPGAs applications.

  • Artificial intelligence (AI)
  • DO-254
  • Electronic Warfare
  • Random logic
  • Video & Image Processing
  • Bioinformatics
  • Enterprise networking
  • ASIC prototyping
  • Space Applications
  • Wireless Communications

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