10M50DAF256C6GES Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. A total of 178 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block consists of 50000 logic elements/cells. Surface Mount-connectors can be used to attach this FPGA module to the development board. A supply voltage of 1.15V~1.25V is needed in order for fpga chips to operate. FPGAs belonging to the MAX? 10 series are a type of FPGA that belong to the MAX? 10 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. There is an FPGA model contained in Tray in order to conserve space. There are 1677312 RAM bits that are available with this device. 3125 LABs and CLBs are built into this FPGA. As a supplier, 256-FBGA (17x17) is responsible for the package of its devices.

10M50DAF256C6GES Features

178 I/Os
Up to 1677312 RAM bits

10M50DAF256C6GES Applications

There are a lot of Intel 10M50DAF256C6GES FPGAs applications.

• Automation
• Aircraft navigation
• Filtering and communication encoding
• Consumer Electronics
• Industrial Ethernet
• Camera time adjustments
• Data Center
• Aerospace and Defense
• Telecommunication
• Radar and Sensors